RFID Flip Chip Equipment
Product Details:
| Place of Origin | Beijing, China |
|---|
Payment & Shipping Terms:
| Minimum Order Quantity: | 1 Set/Sets |
|---|---|
| Payment Terms: | L/C,T/T |
Detailed Product Description
System Structure
Modularized Design
Tight and easy connection between modules to make sure stability.
Easy to select different modules to meet the different requirements
1. Feeder module
2. Wafer Aligner & Flipper
3. Robot System for picking die , gluing and placing Die
4. Heat pressing curing module
5. Read-Write test module
6. Dividing and cutting (optional) module
7. Rewinding module
Much stronger structure, for wide width equipments
We are using Double Wall Board Structure to hold the rollers, which can be very stable forever
Competitors are using cantilever rollers, which will be deformed after several years using
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Antenna Source
Can use any possible antennas
Special antenna guiding system against the antenna broken problem
Reel to Reel
Inside Diameter76mm
Outside Diameter600mm
Width500mm
Thicknessover 0.04mm
Reel Material
PET, PAPER etc.
Working Channel
HF
UHF
Conductive Glue of printed antenna
Silver
Etched Antenna
Aluminium, Copper
Wafer/Die Feeding System
Have wafer feeding system
Flexible wafer feeding system. Very useful for the testing orders
Wafer Aligner: move wafer automatically to standard position
Capability of utilize all formats of wafer suppliers, including Philips, TI, ST and Infineon.
Wafer Specification6, 8, can be updated to 12
Die Size0.3-12mm
Die Thickness0.1-3.0mm
Flipper: Flip chip and move to standard position for picking up
Motion System
Use advanced USA made high performance (micron precision) Robot and its Controlling System
Best Performance
Ensure the high precision of picking and placing.
Ensure to product various kinds of smart label.
The smart label of UHF certainly require high precision motion system.
Machine Vision System
Machine vision is widely used to make sure high quality products and UHF labels (sensitive to positioning precision) can be made.
When four heads get the flipped chips, vision systems are used to look at the die to find out:
Bump Position
Chip Appearance
Before placing the flipped chips to antenna pads, vision systems will find out the
Antenna Position
Optimize the position of ACP gluing position and die placing position to make sure the best quality, yield, and long life of smart label
Gluing System
Preparing and switching time between products: 2-6 hours.
Use advanced gluing system which is designed for ACP gluing
High precision
Adaptable for nearly all possible sizes of needles
Be Available to use different kinds of glue
ACP (for small size dies)
ICP and Sticking Glue (for big size dies)
Be available to gluing with different shapes
Dot gluing ( for small sizes die )
Line gluing (for big sizes die)
Printing Glue Method (optional)
Heat Press Curing Work Cell
Patented multi-head pressure control system can provide best protection to the weak dies
Pressure control system can provide wider pressure control scope: 0-1000N
Simultaneous heating from upward and downward
16/32/64 Heating-head
The heating temperature of each head could be separately controlled. The Control Precision±1
High-temperature-proof film is attached on the die before Heat Press curing to get to balance pressure and prevent from glue dropped to die or heating head which will cause the die break.
Pressure Control Precision0.05N
Report of Delo.
Delo is the biggest ACP supplier of smart label industry.
Among the report, Delo give us pretty good remark.
Under normal condition, the die shear force changes from 2.6-2.9 Kg. Much higher than the Standard: 300 g.
Especially the 1st conclusion in the last page: Bonding force (unknown) seems well-balanced shows our quality is steady.
Read-Write & Personalization Module
Can do not only S/N checking, but also Personalization
Have special know-how to do simultaneous personalization for a numbers of smart labels on line, competitors can only read S/N
Each smart label will have about 3 seconds time for personalization, which is 6 times longer then others
Optional modules can be compatible with most of the protocols in the world
Special designed surroundings to make sure the performance of Read-Write & Personalization
Dividing and Cutting Module
Dividing adjusting time: 1-2 hours. Competitors may need 1-2 days for the thin antenna
Use high precision dividing and cutting instrument to work as customers requirements
Dividing big reel ( 4-8 lines) to small reel (single line)
Can supply cutting the big reel into sheets (optional)
Re-winding System
Automatically re-wind the finished products into reel.
Rewinding System
Know How of Production and QC
Can supply customer the needed know how of production and Q.C.
QC Routine
Read-Write Test
Bonding Strength Test
Die-Shear Force Test
Reliability Test
Temperature Cycling Test
Humidity Cycling Test
RFID Flip Chip Equipment
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Company Info
Beijing Intermediate International Co., Ltd.
[China (Mainland)]
[Verified Member]
City: Beijing
Province/State: Beijing
Country/Region : China (Mainland)
Business Type:Manufacturer, Trading Company
Online Postings: Products







